Integrated electronic assembly for conserving space in a circuit

ABSTRACT

An integrated electronic assembly including a first electronic component defining a receptacle and at least a second electronic component wherein at least a portion of the second electronic component is disposed in the receptacle of the first electronic component, and a method for conserving space in a circuit or on a printed circuit board by integrating a plurality of electronic components so that the plurality of electronic components collectively take up a smaller amount of space on a substrate than the plurality of electronic components would if the plurality of electronic components were not integrated.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of prior U.S. application Ser. No.14/572,348, filed Dec. 14, 2014, which is a continuation of prior U.S.application Ser. No. 12/695,583, filed Jan. 28, 2010, now U.S. Pat. No.8,945,948, issued Feb. 3, 2015, which is a divisional of prior U.S.application Ser. No. 11/465,215, filed Aug. 17, 2006, now U.S. Pat. No.7,690,105, issued Apr. 6, 2010, which claims the benefit of U.S.Provisional Application No. 60/709,491, filed Aug. 19, 2005, which areall hereby incorporated herein by reference in their entirety.

FIELD OF THE INVENTION

This invention relates generally to electronic components and moreparticularly concerns integrated electronic assemblies for conservingspace in a circuit or on a substrate.

BACKGROUND OF THE INVENTION

The electronics industry is continually called upon to make productssmaller and more powerful. Applications such as mobile phones, portablecomputers, computer accessories, hand-held electronics, etc., create alarge demand for smaller electronic components. These applicationsfurther drive technology to research new areas and ideas with respect tominiaturizing electronics and often require “low profile” components dueto constraints in height and width. Unfortunately, the technology isoften limited due to the inability to make certain circuits andcomponents smaller, faster, or more powerful. Nowhere can this be seenmore than in the struggle to manufacture smaller electronic circuits andcomponents which take up less space on a substrate, such as a printedcircuit board (“PCB”).

Originally, individual components had to be mounted on a PCB byinserting the leads of the component through holes in the PCB andsoldering them to solder pads on the opposite side of the PCB, (calledthrough-hole technology). This technique left half of the PCBunpopulated because one side had to be reserved for solder pads andsolder and required enough space on the PCB to mount each individualcomponent. Therefore, in order to fit more components in a particularcircuit, the PCBs were made larger, or additional PCBs were required.Many times, however, these options were not available due to constraintsin size for the PCBs.

A solution to this problem came in the form of Surface-Mount Devices(“SMD”), or Surface-Mount Technology. SMDs allow electronic devices orcomponents to be mounted on one side of a substrate, (i.e., withouthaving leads inserted through holes in the substrate). An SMD device hassmall metalized pads (solder pads, terminals or leads) connected to itsbody, which correspond to solder pads or lands placed on the surface ofthe substrate. Typically the substrate is run through a solder-pastemachine, such as a screen printer, which puts a small amount of solderon the substrate lands. Then, the component is placed on the substrate,and the substrate and SMD device are sent through a re-flow oven to heatthe solder paste and solder the component leads to the substrate lands(“reflow soldering”). The primary advantage to this technique is thatboth sides of the substrate can now be populated by electroniccomponents. Meaning one substrate today can hold an amount of electroniccomponents approximately equal to two substrates in the past.

Another solution to this problem was the development of the integratedcircuit (“IC”), which allowed circuits made up of multiple electroniccomponents to be combined into one packaged component. This allowed morecomponents to be mounted on a substrate and reduced the amount ofsubstrate space used (and therefore needed) by replacing multipleindividual electronic components with one IC package. This also loweredmanufacturing times for assembling electronics by reducing the number ofcomponents that had to be mounted to the substrate. Today, substratescontinue to be populated with ICs and individual electronic componentsthat have not been incorporated into an IC package (“discretecomponents”).

As a result of these advances in technology, current electronic circuitsare mainly limited by the size and number of components needed to beused on the PCB. Meaning, if the electronic components are made smalleror fewer components are needed for a particular circuit, the circuit canbe made smaller as well. Unfortunately, there are some electroniccomponents that a circuit cannot due without and that cannot be producedany smaller than they currently are without sacrificing something,(e.g., performance, structural integrity, etc.). Usually this is becausethe desired parameters for the component cannot be achieved when usingsmaller parts. Good examples of this are coil components, such as forexample, inductors, antennas, transformers, chokes and the like. Certainparameters of these components are affected by the size of the partsused. For instance, in inductors, wire gauge determines both the DCresistance and the current carrying ability of the component. In otherexamples, the component may be capable of being made in a smaller size,but incapable of performing comparably to the original larger version ofthe component, (e.g., with comparable inductance, frequency range,Q-value, self-resonant frequency, or the like).

Accordingly, it has been determined that the need exists for an improvedelectronic component which overcomes the aforementioned limitations andwhich further provides capabilities, features and functions, notavailable in current devices and for a method of conserving space in acircuit.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A is a plan view of an integrated electronic assembly according tothe invention with the top of the body removed so that the second andthird electronic components located within the first electroniccomponent are visible;

FIG. 1B is a side elevational view of the integrated electronic assemblyof FIG. 1, with the first electronic component shown in cross-section sothat the second and third electronic components are visible;

FIG. 2A is a plan view of an alternate first electronic component foruse in an integrated electronic assembly according to the invention,shown without the wire winding for purposes of clarity;

FIG. 2B is a side elevational view of the first electronic component ofFIG. 2A;

FIG. 2C is a bottom view of the first electronic component of FIG. 2A;

FIG. 2D is a cross sectional view of the first electronic component ofFIG. 2A taken along line 2D-2D in FIG. 2A;

FIG. 3A is a plan view of an alternate first electronic component foruse in an integrated electronic assembly according to the invention;

FIG. 3B is a side elevational view of the first electronic component ofFIG. 3A;

FIG. 3C is a bottom view of the first electronic component of FIG. 3A;and

FIG. 3D is a cross sectional view of the first electronic component ofFIG. 3A taken along line 3D-3D in FIG. 3A.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

An integrated electronic assembly in accordance with the inventionincludes a first electronic component and at least a second electroniccomponent wherein the first electronic component defines a receptacle,such as a recess or opening, into which at least a portion of the secondelectronic component is disposed. Once the second electronic componentis disposed in the opening of the first electronic component, the firstand second electronic components collectively form an integratedelectronic assembly which may be connected to a substrate, such as aPCB, as a single component or assembly or within the footprint of asingle component as will be discussed further below.

In a preferred form, the first electronic component has a footprint of aspecified size for mounting the first electronic component to the PCBand defines a sufficient opening so that the second electronic componentcan be mounted to the PCB within the footprint of the first electroniccomponent. The first electronic component may be a discrete component,such as a coil component, which defines an opening into which a secondelectronic component, such as an IC or, alternatively, another discretecomponent, is inserted. For example, in one form, the first electroniccomponent may be a magnetic component, such as an inductor, whichdefines an opening for receiving at least a portion of a second discretecomponent, such as a capacitor. In another form, the first electroniccomponent may consist of another discrete component which defines anopening for receiving at least a portion of an IC. In still other forms,the first electronic component may define a receptacle capable ofreceiving two or more additional electronic components, such as forexample, both an additional discrete component and an IC.

Turning now to FIGS. 1A-B, there is illustrated an integrated electronicassembly 10 embodying features of the present invention. The integratedelectronic assembly 10 includes a first electronic component, such asinductor 20, a second electronic component, such as IC 30, and a thirdelectronic component, such as capacitor 40. Although the embodimentillustrated uses a discrete component as the first electronic componentand both an IC and an additional discrete component as the second andthird electronic components, it should be understood that anycombination of discrete components and/or ICs may be used to form anintegrated electronic assembly in accordance with the invention.

In FIGS. 1A-B, the first electronic component 20 is an inductor having abody, such as form or core 20 a, about which a conductive element, suchas wire 22, is wound to form a coil through which current may becarried. The core 20 a is preferably made of a high temperature plasticmaterial or a magnetic material, such as ferrite, and defines areceptacle for receiving at least a second electronic component. Forexample, in the embodiment illustrated, the core 20 a defines a firstreceptacle, such as first opening 20 b, for receiving the secondelectronic component 30 and a second receptacle, such as second opening20 c, for receiving the third electronic component 40. In this form, thefirst and second openings 20 b-c defined by the first electroniccomponent 20 collectively form a single opening in the first electroniccomponent 20 for receiving at least a portion of the second and thirdelectronic components, 30 and 40 respectively.

In FIGS. 1A-B, the core 20 a has a bobbin structure including acylindrical center section with upper and lower flanges or flanged ends,respectively, extending from the ends of the center section. Althoughthe core illustrated is symmetrical, it should be understood that avariety of different cores may be used, including asymmetrical cores,(e.g., cores having one flanged end that is larger in diameter than theother flanged end, etc.).

In the embodiment illustrated, metalized pads, such as solder pads 24a-b, are connected to the body 20 a and provide terminals by which thefirst electronic component 20 may be connected into a circuit. Themetalized pads 24 a-b are made of a conductive material and arepreferably fused or bonded to the body 20 a so that the first electroniccomponent 20 may be electrically and mechanically attached tocorresponding lands located on the PCB via solder. More particularly,the metalized pads 24 a-b provide an electrically conductive surface towhich the solder paste printed on the PCB can bond once the firstelectronic component 20 and PCB are passed through a reflow oven. As isdepicted in FIG. 1, the metalized pads 24 a-b are preferably located onthe bottom of the body 20 a. It should be understood, however, thatmetalized pads of different shapes and sizes may alternatively be usedand that the metalized pads 24 a-b may be placed in alternate locationsabout the body 20 a if desired. For example, the metalized pads 24 a-bmay alternately be L-shaped or U-shaped pads that wrap around the sidesof the body 20 a of first electronic component 20. In yet other forms,the metalized pads 24 a-b may be provided as clips which are connectedto the first electronic component 20 rather than being pads fused orbonded onto the body 20 a thereof.

In a preferred embodiment, the wire 22 is an insulated wire such as aforty-two gauge (42 AWG) copper wire having ends 22 a and 22 b connectedto the bottom of the metalized pads 16. It should be understood,however, that any conductive material may be used for the wire and thatthe wire size may be selected from a variety of wire gauges. Forexample, a preferred component may use wire ranging from thirty-twogauge wire to forty-eight gauge wire (32-48 AWG), while alternatecomponents use wires of different wire gauges.

The ends of the wire 22 a-b are preferably flattened (not shown) andbonded to the metalized pads 24 a-b in order to minimize the amount ofspace between the lower surface of the metalized pads 24 a-b and theupper surface of the corresponding substrate lands. This helps maintainthe low profile of the assembly 10 and also helps ensure that thecomponent will remain co-planar when positioned on the substrate so thatthe pads 24 a-b and wire ends 22 a-b will make sufficient contact withthe solder on the substrate and make solid electrical and mechanicalconnections to the circuit on the substrate.

In alternate embodiments, the wire ends 22 a-b may be connected to theinner or outer side surfaces of L-shaped, U-shaped or clip-typemetalized pads, in order to avoid disrupting the flat bottom surface ofpads 24 a-b and in order to avoid increasing the height of the assembly10 and/or creating a gap between any portion of the pads 24 a-b and thecorresponding substrate lands. In yet other embodiments, notches ordimples may be present in the lower surfaces of the body 20 a and/orpads 24 a-b in order to provide a designated location for the wire ends22 a-b to be bonded to the pads 24 a-b without raising the height of theassembly 10 or creating a gap between the pads 24 a-b and correspondingsubstrate lands.

In the embodiment illustrated, a single wire 22 is wound about thecenter section of the core 20 a. It should be understood however, thatin alternate embodiments, multiple wires may be used depending on thetype of component the first electronic component is. For example, in analternate embodiment wherein the first electronic component 20 is atransformer, multiple wires may be used and wrapped around the body 20a. In such embodiments, the component 20 will also include more than twometalized pads for the ends of the wire 22 to be connected to.

In FIGS. 1A-B, the second electronic component 30 is shown as an IC andthe third electronic component 40 is shown as another discreteelectronic component, such as a capacitor. The IC 30 may contain anynumber of active and/or passive components which are constructed on asubstrate, such as semiconductor wafers (e.g., silicon, gallium arsenideor the like), glass substrates, insulative substrates or any otherconventional IC material, and both the IC 30 and capacitor 40 may be ofa variety of different sizes and shapes. In the form illustrated, boththe IC 30 and capacitor 40 have metalized pads, 32 and 42 respectively,for electrically connecting the second and third components 30 and 40into the substrate circuit. For example, the metalized pads or pins 32of IC 30 may be aligned with and soldered to corresponding lands on thesubstrate in order to connect the IC 30 to the circuit on the substrate.Similarly, the metalized pads 42 of capacitor 40 may be aligned with andsoldered to corresponding lands on the substrate in order to connect thecapacitor 40 into the circuit on the substrate.

In FIGS. 1A-B, the inductor 20, IC 30 and capacitor 40 make up a portionof a power supply circuit. Thus, in this form, some or all of the powersupply components are capable of being disposed or housed inside theinductor 20, which is typically the largest component in a low powerswitching regulator. In other embodiments, the assembly 10 may bedesigned so that all or most of the other power supply components areplaced inside the first electronic component 20. Thus, thisconfiguration may be used to reduce the size of switching power supplieswhile allowing the switching power supplies to provide higher powerdensity.

As mentioned above, the assembly 10 may be provided as a single modulewith the first, second and third electronic components, 20, 30 and 40respectively, already connected to one another (i.e., a pre-connectedconfiguration). The connection between the components, 20, 30 and 40,may either be a simple mechanical one wherein the components are heldtogether but are not electrically connected, or may be anelectro-mechanical one wherein the components are held together and areelectrically connected to one another to create a circuit. With amechanical connection, the components may be mechanically connected toone another via an adhesive or other conventional method for connectingelectronic components or their parts. With an electro-mechanicalconnection, the components may be wired together in addition to beingsecured into position via an adhesive or the components may be connectedto their own substrate having traces electrically connecting thecomponents into a circuit. Regardless of which type of pre-connectionconfiguration is used, however, the assembly 10 will be capable of beingplaced as a single module or part rather than requiring the placement ofthe individual components.

Alternatively, the components 20, 30 and 40 may simply be provided apartfrom one another (i.e., an unconnected configuration) and assembled bythe circuit manufacturer into the integrated electronic assembly 10 byplacing one component after the other until the assembly 10 is complete.In a preferred form, however, the assembly 10 will be provided in apre-connected configuration wherein the components are mechanicallyconnected to one another, but not electrically connected to one another.This configuration provides the circuit designer with flexibility indeciding how to interconnect the components of the assembly 10 andeliminates or greatly reduces the volume, cost and reduced reliabilityof using an additional or duplicate substrate to electro-mechanicallyconnect the components. This configuration also reduces the number ofcomponents that must be placed on the substrate in order to complete thecircuit and, thus, should result in faster more efficient manufacturing.For example, an electronic device manufacturer's PCB may be designed toprovide lands and traces that correspond to the metalized pads of theelectronic components 20, 30 and 40, so that the assembly can simply bepicked and placed on the substrate as a single module and electricallyconnected to the circuit via reflow soldering. This configuration alsoconserves space on the overall circuit by mounting multiple electroniccomponents within the footprint of a single component.

If the assembly 10 is to be provided in either the mechanicallyconnected configuration or the electro-mechanical configuration, thecomponents 20, 30 and 40 will be assembled by aligning the components intheir proper x, y and z axis to ensure correct location/positioning andto ensure co-planarity of their respective metalized pads 22 a-b, 32 and42. Then, in a preferred form, the components will be connected orsecured to one another using materials suitable for maintainingcomponent alignment before, during and after reflow soldering. Theassembly 10 may then be inspected and tested to ensure proper operationand construction, if desired.

If the assembly 10 is to be provided in an unconnected configuration,the components 20, 30 and 40 will be assembled via conventionalpick-and-place equipment and the components will be electricallyconnected to one another via the corresponding lands and traces of thesubstrate. In a preferred form, the electronic components located withinthe receptacle of the first electronic component will be mounted on thesubstrate first and then the first electronic component will be mountedto the substrate. Although this configuration does not reduce the numberof components that are placed on the substrate, it does conserve spacein the substrate circuit by mounting multiple electronic componentswithin the footprint of one single component.

Although the embodiment illustrated in FIGS. 1A-B and discussed aboveshows the assembly 10 made up of three separate components, it should beunderstood that the assembly 10 may alternately be made up of twocomponents or, in yet other embodiments, may be made up of more thanthree components if desired. In addition, although the applicationdiscussed above is for a power supply component (e.g., a power switchingregulator), it should be understood that the concept of an integratedelectronic assembly in accordance with the invention may be used in anyapplication where space is critical, such as for example, in portableelectronics, hand-held electronics, cell phones, digital cameras, musicand video players, laptops, LED flashlights, and the like.

Turning now to FIGS. 2A-D, there is illustrated an alternate embodimentof the first electronic component 20 of integrated electronic assembly10. In this embodiment, an outer body or base is used in connection withthe first electronic component 20, with the outer body or base defining(at least in part) the receptacle into which any additional electroniccomponents are disposed. For convenience, features of alternateembodiments illustrated in FIGS. 2A-D that correspond to featuresalready discussed with respect to FIGS. 1A-B are identified using thesame reference numeral in combination with an apostrophe or primenotation (′) merely to distinguish one embodiment from the other, butotherwise such features are similar.

In the alternate embodiment of electronic component 20 illustrated,(hereinafter component 20′), the first electronic component 20′ includesan outer body or base 26 which is made of an insulating material, suchas a non-conductive plastic or ceramic. In the form illustrated the base26 has a polygonal shape and has smooth planer top 26 a and bottom 26 bsurfaces. The base 26 further defines an opening or recess 26 c forreceiving at least a portion of core 20 a′ and defines a receptacle 26 dfor receiving any additional electronic components such as second andthird electronic components 30 and 40. In the form illustrated, therecess or opening 26 c and receptacle 26 d are formed by the aperturethrough the base 26. Thus, both the core 20 a′ and base 26 define theboundary of receptacle 26 d. However, it should be understood that inalternate embodiments the base 26 may be provided with a separate anddistinct recess 26 c and receptacle 26 d, if desired. For example, in analternate embodiment, a wall or partition may be used to separate therecess 26 c and receptacle 26 d from one another. It should also beunderstood that in alternate embodiments the base 26 may be provided ina different shape, such as for example in a generally rectangular shapeor in a generally round or circular shape.

In the embodiment illustrated in FIGS. 2A-D, the side wall of base 26that defines recess 26 c has a radius of curvature and diameter whichcorresponds to or compliments the radius of curvature and diameter ofthe flanged ends of core 20 a′. In a preferred form, the flanged ends ofcore 22 a′ fit loosely within the recess 26 c so that space is providedbetween the outer edge of the flanged ends and the inner side wall ofbase 26, which allows the core 22 a′ to be installed into the base 26more easily. In addition, the core 22 a′ is positioned such that the topof the core's upper flanged end is about even, or coplanar, with the topsurface 26 a of base 26, which helps provide a generally flat uppersurface with which the component 20 may be picked up and placed on asubstrate circuit.

In the form shown, the pieces of the first electronic component 20′,such as the base 26 and core 22 a′, are held together via a film layer,such as adhesive tape 28, which may be positioned over the top of base26 a and core 20 a′. The film 28 serves as a structural member of thecomponent and, in a preferred embodiment, comprises a flexible memberhaving an adhesive layer on the bottom and a printable layer on the top.Thus, in addition to keeping the pieces of the first electroniccomponent 20′ together, the film 28 provides the component manufacturerwith a surface for printing indicia, such as product numbers,trademarks, and other desirable information. The film 28 alsoestablishes a generally planar top surface with which the assembly 10 orfirst electronic component 20′, depending on how the assembly isconfigured (i.e., connected or unconnected configurations), may bepicked from conventional tape and reel packaging and placed on asubstrate using industry standard vacuum pick-and-place machinery. In apreferred embodiment, film 28 may be a polyimide film, apolyetheretherketone (PEEK) film, a liquid crystal polymer (LCP) film orthe like. These and other details regarding film 28 may be found in U.S.Pat. No. 6,914,506 issued Jul. 5, 2005, which is hereby incorporatedherein by reference in its entirety.

In the embodiment illustrated in FIGS. 2A-D, the first electroniccomponent 20′ has a height of 1 mm, a length and width of 3 mm each, anda receptacle 26 d that is 0.72 mm high with an annular inner wall radiusof 1.2 mm. Unlike the first electronic component illustrated in FIGS.1A-B, component 20′ has metalized pads 22 a′-b′ which are connected tothe bottom surfaces 26 b of base 26. The base 26 of first electroniccomponent 20′ also defines ventilation openings 26 e-f which allow airto circulate through the assembly 10 and over any additional electroniccomponents disposed within receptacle 26 d. In the form illustrated, theventilation openings 26 e-f are formed by leg members extending downfrom the base 26 and bounded by the bottom surfaces of base 26 and itsleg members.

In FIGS. 3A-D, there is illustrated yet another embodiment of the firstelectronic component 20 of assembly 10 embodying features in accordancewith the present invention. In this embodiment, like the embodimentillustrated in FIGS. 2A-D, an outer body or base is used in connectionwith the electronic component 20, with the outer body or base defining(at least in part) the receptacle into which any additional electroniccomponents are disposed. Unlike the embodiment illustrated in FIGS.2A-D, however, the core illustrated in the electronic component of FIGS.3A-D is much larger leaving a smaller sized receptacle into which theadditional electronics can be inserted. For convenience, features ofalternate embodiments illustrated in FIGS. 3A-D that correspond tofeatures already discussed with respect to FIGS. 1A-B and FIGS. 2A-D areidentified using the same reference numeral in combination with an aquotation mark or double prime notation (″) merely to distinguish oneembodiment form the other, but otherwise such features are similar.

In the embodiment illustrated in FIGS. 3A-D (hereinafter 20″), theelectronic component 20″ includes a similar structure to that ofcomponent 20′ in FIGS. 2A-D. For example, component 20″ has a base 26″defining an opening or recess 26 c″ into which at least a portion ofcore 20 a″ is disposed and ventilation openings 26 e″-f″. The base 26″further includes metalized pads 22 a″-b″ and has a wire (not shown)wound about the reduced diameter center portion of core 20 a″ and havingfirst and second wire ends which are connected to their respectivemetalized pads 22 a″-b″. The base 26″ and core 20 a″ are connected orsecured to one another via an adhesive film layer, such as tape 28″,which provides a generally flat upper surface for conventionalpick-and-place equipment to pick up and place component 20″ andpreferably provides a surface for providing indicia. Unlike thecomponent 20′ of FIGS. 2A-D, however, the core 20 a″ is much larger,thereby, leaving a smaller sized receptacle for receiving additionalelectronic components, such as second and third electronic components 30and 40. For example, in the form illustrated in FIGS. 3A-D, the core 20a″ has a height of 0.78 mm as compared to the 0.28 mm height of the core20 a′ in FIGS. 2A-D. Thus, with this configuration, the receptacle 26 d″of FIGS. 3A-D has a height of 0.22 mm and an annular inner wall radiusof 1.2 mm and will only be able to house smaller additional electroniccomponents than component 20′.

An advantage to the structures of FIGS. 2A-D and FIGS. 3A-D over that ofFIGS. 1A-B is that the base 28 or 28″ can be made of any height desiredin order to adjust the size of the receptacle in the first electroniccomponent. Whereas, in the bobbin configuration illustrated in FIGS.1A-B, the core 20 a actually has to be bored out in order to provide thedesired receptacle size. Thus, in the embodiments of FIGS. 2A-D and3A-D, existing core structures may be used rather than requiring specialcore structures to be built.

It should be understood that the assembly 10, including any of itscomponents, may be made in a variety of shapes and sizes and used toconserve space in a circuit. Thus, in accordance with the presentinvention, an integrated electronic assembly and method of conservingspace in a circuit are provided that fully satisfies the objects, aims,and advantages set forth above. While the invention has been describedin conjunction with specific embodiments thereof, it is evident thatmany alternatives, modifications, and variations will be apparent tothose skilled in the art in light of the foregoing description.Accordingly, it is intended to embrace all such alternatives,modifications, and variations as fall within the spirit and broad scopeof the appended claims.

What is claimed is:
 1. An integrated electronic assembly comprising: adiscrete electronic component comprising: a coil having a coil bodydefining a first opening; terminals connected to or extending from thecoil body for electrically and mechanically connecting the integratedelectronic assembly to a substrate; and a wire having first and secondends which are connected to respective terminals on the body and woundabout the coil body to form a coil through which current may travel; andan integrated circuit disposed incorporated into the electroniccomponent and forming an integrated electronic assembly; wherein theintegrated circuit is disposed in the opening of the coil body so thatthe discrete electronic component and the integrated circuit form asingle assembly.
 2. The integrated electronic assembly of claim 1,wherein the coil body defines a second opening and the integratedelectronic assembly further includes a capacitor disposed in the secondopening so that the coil, the integrated circuit, and the capacitor forma single assembly.
 3. The integrated electronic assembly of claim 1,wherein the discrete electronic component comprises at least one of acapacitor, inductor, resistor or transformer.
 4. An integratedelectronic assembly comprising: an integrated circuit having a generallyflat upper surface; and a first discrete electronic component having afootprint of a specified size for mounting the first discrete electroniccomponent to the substrate and a body having a generally flat uppersurface, the body further defining a first recess in a bottom surface ofthe body and into which at least a portion of the integrated circuit isdisposed so that the first discrete electronic component is stacked ontop of the integrated circuit and the integrated circuit may be mountedto the substrate within the footprint of the first discrete electroniccomponent thereby reducing the amount of space that is taken up by thediscrete electronic component and the integrated circuit.
 5. Theintegrated electronic assembly of claim 4, wherein the body of the firstdiscrete electronic component defines a second recess in the bottomsurface of the body and the integrated electronic assembly includes asecond electronic component having a generally flat upper surface, thesecond electronic component being at least partially disposed within thesecond recess of the first discrete electronic component thereby furtherreducing the amount of space taken up by the electronic components andthe integrated circuit.
 6. The integrated electronic assembly of claim5, wherein the first and second recesses defined by the first discreteelectronic component collectively form one large opening in the firstdiscrete electronic component for receiving at least a portion of theintegrated circuit and the second electronic component.
 7. Theintegrated electronic assembly of claim 5, wherein the first discreteelectronic component further defines a ventilation opening to provideventilation to any additional electronic components located therein whenthe integrated electronic assembly is connected to a substrate.
 8. Anintegrated electronic assembly comprising: a first finished electroniccomponent defining a cavity and having a generally flat upper surface; asecond finished electronic component having a generally flat uppersurface, the second finished electronic component being disposed withinthe cavity of the first finished electronic component such that thefirst and second electronic components may be mounted to the outersurface of the substrate in such a way that conserves space on the outersurface of the substrate and wherein the first and second finishedelectronic components are mounted to the outer surface of the substratein such a way as to allow for the circulation of air about the secondfinished electronic component when the components are mounted to thesubstrate.
 9. The integrated electronic assembly of claim 8, wherein thecavity defined by the first finished electronic component is defined ina bottom surface of the first finished electronic component so that thefirst finished electronic component is stacked on top of the secondfinished electronic component when the first and second finishedelectronic components are mounted to the outer surface of the substrateto conserve space on the outer surface of the substrate.
 10. Theintegrated electronic assembly of claim 9, wherein the outer surface ofthe substrate is two dimensional and defined by x and y planes and thefirst finished electronic component is a coil component and has afootprint of space the coil component takes up on the outer surface ofthe substrate when mounted to the outer surface of the substrate and thesecond finished electronic component is an integrated circuit so thatthe integrated circuit can be mounted to the outer surface of thesubstrate within the footprint of the coil component to conserve spacein the x and y planes that define the outer surface of the substrate.11. The integrated electronic assembly of claim 10, wherein the firstfinished electronic component surrounds circumferentially orperipherally and covers the second finished electronic component and thefirst and second finished electronic components have respective bottomsurfaces that are generally coplanar with one another when the first andsecond electronic components are mounted to the outer surface of thesubstrate.
 12. An integrated electronic assembly comprising: a coilpositioned in an upper portion of the electronic assembly and located ina first horizontal plane; and an integrated circuit positioned in alower portion of the electronic assembly and located in a secondhorizontal plane separate from and parallel to the first horizontalplane, both the coil and integrated circuits having generally flat uppersurfaces; and wherein the coil is connected to a base that has portionsextending down from the base and coil on opposite sides of theintegrated circuit to provide spacing or a recess within which theintegrated circuit may be mounted.
 13. An electronic assemblycomprising: a first discrete electronic component comprising a coil andhaving a body with portions that extend down on opposite sides of thebody to define spacing or a recess within which a second electroniccomponent may be disposed, the coil being positioned in a firsthorizontal plane and the spacing or recess defined by the body beingpositioned in a second horizontal plane separate from and parallel tothe first horizontal plane, the first discrete electronic componentfurther having a generally flat upper surface.
 14. The electronicassembly of claim 13, further comprising a second electronic componentcomprising an integrated circuit disposed in the spacing or recessdefined by the body of the first discrete electronic component, thesecond electronic component having a generally flat upper surface.